Package Design Engineer

NXP in Greater China · Nijmegen; Eindhoven

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About this role

The Package Innovation (PI) department is an organization within NXP's Corporate Technology Office that develops advanced semiconductor packaging solutions and next-generation packaging technologies across all NXP product lines. The Package Design team is a centralized global function responsible for package development and package design execution across NXP. This position primarily supports…

Excerpt only. The full posting is on the employer’s careers site.

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